• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    . Device for preventing the formation of icicles, which device comprises a heat pump (1) known per se, of the liquid-liquid type with a cold and a hot side for heating a building (2). The heat pump (1) comprises a closed flow circuit (3) with a heat carrier, which is heat exchanged with a medium in an external flow circuit (4). The heat pump comprises a compressor (6), by means of which the temperature of the heat carrier is raised and an expansion valve (10), where the temperature of the heat carrier is lowered. The invention is characterized in that a part of the closed flow circuit (3) between said expansion valve (10) and a first heat exchanger (5), in which heat exchanger heat carrier rents up heat energy from an external flow circuit, is placed in pipes (12) at least at the foot of the building's roof and by the heat pump is arranged so that the heat carrier's temperature mentioned part of the closed flow circuit (3) falls below the freezing point to such an extent that heat from the roof (13) foot (11) does not melt snow at the roof foot.
    公开号:SE1151119A1
    申请号:SE1151119
    申请日:2011-11-24
    公开日:2013-05-25
    发明作者:Lars A Bergkvist
    申请人:Lars A Bergkvist；
    IPC主号:
    专利说明:

    The present invention thus relates to a device for preventing the formation of icicles, which device comprises a per se known heat pump of the liquid-liquid type with a cold and a hot side for heating a building. , wherein the heat pump comprises a closed flow circuit with a heat carrier, which is heat exchanged with a medium in an external flow circuit in a first heat exchanger where the temperature of the heat carrier is increased and where the heat pump comprises a compressor, by means of which the temperature of the heat carrier is raised. heat exchanger to a medium, which is led to heaters in the building and where the heat carrier after the second heat exchanger passes an expansion valve, where the temperature of the heat carrier is lowered, after which the heat carrier is led back in the closed circuit to the first heat exchanger and characterized by a part of the closed flow circuit between said expansion valve and said the first heat exchanger is located in pipes (12) at least at the foot of the building's roof and because the heat pump is arranged so that the heat carrier's temperature in said part of the closed flow circuit is below freezing to such an extent that heat from the roof foot does not melt snow at the roof foot.
    The invention is described in more detail below, partly in connection with an exemplary embodiment of the invention shown in the accompanying drawing, in which - figure 1 schematically shows a known heat pump - figure 2 shows a pipe system according to the invention - figure 3 schematically shows a section of a eaves.
    The present invention relates to a device for preventing the formation of icicles. hz docwork ansökstext.docx, 201 1-1 1-24 1 10048EN 10 15 20 25 30 The device comprises a heat pump 1 known per se with a cold and a hot side for heating a building 2. The heat pump 1 is of the liquid-liquid type.
    The heat pump 1 comprises a closed flow circuit 3 with a heat carrier, which is heat exchanged against a medium in an external flow circuit 4 in a first heat exchanger 5 where the temperature of the heat carrier is increased. For example, the external flow circuit may be a closed circuit, where a heat carrier is led down into the ground or the bedrock where the heat carrier absorbs heat energy, which is heat exchanged in the first heat exchanger, so that the heat carrier in the closed circuit is heated.
    The heat pump further comprises a compressor 6, by means of which the temperature of the heat carrier is raised. The heated heat carrier is heat exchanged in a second heat exchanger 7 to a medium, which is led to heaters in the property. An external circuit for the heaters is called 8.
    After the second heat exchanger 7, the heat carrier passes a non-return valve 9 and an expansion valve 10, where the temperature of the heat carrier is lowered, after which the heat carrier is led back in the closed flow circuit 3 to the first heat exchanger 5.
    According to the invention, a part of the closed flow circuit 3, between said expansion valve 10 and said first heat exchanger 5, is 11 feet. placed in pipe 12 at least at the roof of the building. Furthermore, the heat pump 1 is arranged so that the temperature of the heat carrier in said part of the closed flow circuit 3 falls below the freezing point to such an extent that heat from the roof foot 11 does not melt snow at the roof foot. hz docwork ansökstext.docx, 201 1-1 1-24 1 10048EN 10 15 20 25 30 According to a preferred embodiment, said part of the closed flow circuit consists of spaced apart and parallel tubes 12, which are interconnected with each other and of the tubes 12 resting on the roof 13.
    It is also preferred that said pipe be placed 12 years from the roof 13 feet 11 and a piece up on the roof of at least one tenth of the length of the roof pitch.
    It is preferred that the pipes are made of any of the metals copper, aluminum or stainless steel, due to the fact that pipes in these metals have a high thermal conductivity and are corrosion resistant. The pipes 12 can further be provided with flanges abutting against the roof to increase the heat transfer from the roof to the heat carrier in the pipes 12.
    As illustrated in Figures 1 and 2, the tubes 12 are interconnected and interconnected with an inlet tube 14 to the first heat exchanger 5, via a tube 16 and interconnected with an output tube 15 from the second heat exchanger, via a tube 17, so that a closed circuit is formed.
    The 12-year-old pipes were placed on the roof at its foot 11. The 12-year-old pipes were placed directly on a roofing felt or similar.
    It was stated above that the heat pump 1 is arranged so that the temperature of the heat carrier in said part of the closed flow circuit 3 is below the freezing point to such an extent that heat from the roof foot 11 does not melt snow at the foot of the roof. Those skilled in the art have no difficulty in adjusting the temperature of the heat bar in relation to the number of pipes and their placement, so that it is achieved that the heat is removed from the roof, at least at its foot, so that snow does not melt at the foot of the roof. hz docwork ansökstext.docx, 201 1-1 1-24 1 10048EN 10 15 20 As the snow does not melt, no water is formed, so icicles will not form.
    By removing heat from the roof by means of a heat pump, which is used to heat the building, no supply of extra energy is needed to the heat pump to achieve the technical effect according to the invention.
    The present invention thus solves the problem mentioned in the introduction.
    A number of embodiments have been described above. However, this can be varied, for example with regard to the number of pipes and the design of the pipes.
    The present invention should therefore not be construed as limited to the above embodiments, but may be varied within its scope as set forth in the appended claims. hz docwork ansökstext.docx, 201 1-1 1-24 110048EN
    权利要求:
    Claims (4)
    [1]
    A device for preventing the formation of icicles, which device comprises a per se known heat pump (1) of the liquid-liquid type with a cold and a hot side for heating (2), the flow circuit (3) a building where the heat pump (1) comprises a slu- with a heat carrier, which is heat exchanged with a medium in an external flow circuit (4) in a first (5), the heat pump comprises a compressor where the temperature of the heat carrier is increased and then (6), after which the heated heat exchanger by means of which the temperature of the heat carrier is raised, the carrier is heat exchanged in a second heat exchanger (7) to a medium which is led to heaters in the building and where the heat carrier after the second heat exchanger (7) passes an expansion valve (10 ), where the temperature of the heat carrier is lowered, after which the heat carrier is returned to the closed flow circuit (5), that a part of the closed flow circuit (3) between said expansion valve (10) (12) then (3) to the first heat exchanger k ä nnetec k- and said first heat exchanger (5) is located in pipes at least at the foot of the roof of the building and in that the heat pump is arranged so that the temperature of the heat carrier in said part of the closed flow circuit (3) is below the freezing point to such an extent that heat from the foot (13) of the roof (13) does not melt snow at the foot of the roof.
    [2]
    Device according to claim 1, characterized in that said part of the closed flow circuit (3) consists of spaced apart and parallel pipes (12) which are interconnected with each other and in that the pipes (12) rest on the roof. (13). k ä n n e t e c k n a d av, att (ll)
    [3]
    Device according to claim 2, said pipes (12) being placed from the base of the roof and a hz docwork applicationtext.docx, 201 1-1 1-24 1 10048SE 10048SE 10048SE up to the roof (13) corresponding to at least one tenth of the length of the roof pitch .
    [4]
    Device according to claim 2 or 3, characterized in that the rudders (12) are challenged in one of the metals copper, aluminum or stainless steel. hz docwork ansökstext.docx, 201 1-1 1-24 1 10048EN
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    同族专利:
    公开号 | 公开日
    EP2597401A1|2013-05-29|
    SE536193C2|2013-06-18|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    FR2362346B1|1976-08-17|1982-05-21|Bernier Jacques|
    US4064705A|1976-10-26|1977-12-27|The Rovac Corporation|Air conditioning system having compressor-expander in pressurized closed loop system with solar assist and thermal storage|
    DE3568860D1|1984-09-18|1989-04-20|Sharp Kk|Solar heat collector system|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    SE1151119A|SE536193C2|2011-11-24|2011-11-24|Device for preventing the formation of icicles.|SE1151119A| SE536193C2|2011-11-24|2011-11-24|Device for preventing the formation of icicles.|
    EP12194021.7A| EP2597401A1|2011-11-24|2012-11-23|Device for preventing the forming of icicles|
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